There is a seemingly contradictory trend in the wireless charging industry: power is going up, while component count is going down. From 15W to 25W, power increases by 10W, yet there are fewer devices on the PCB—not because of cost-cutting, but because of a qualitative leap brought by higher chip integration.

This article tears down two Bieland magnetic wireless charging modules—a 25W Qi2.2 magnetic wireless charging module and a 15W Qi2.0 magnetic wireless charging module—to reveal the design logic behind this.

Wireless Charging Module Overview

The two modules have comparable PCB dimensions, both using circular boards. The most obvious difference is color: the 25W wireless charging module uses a green PCB, while the 15W wireless charging module uses a black PCB.

Looking at component count, the difference is significant—the 15W wireless charging module clearly has more components, roughly nearly double by a rough estimate, while the 25W wireless charging module is more streamlined with a cleaner layout.

Coils

Both modules use magnetic coils, with a ring of magnets around the perimeter to enhance magnetic attachment. The modular design approach is consistent, helping customers simplify the product design process and achieve rapid mass production.

USB-C Interface

Both modules are powered via a USB-C interface. On the 25W wireless charging module, the USB-C connector is soldered directly onto the PCB; on the 15W wireless charging module, it is soldered onto a small board and connected via a ribbon cable.

Wireless Charging Module Layout

The front side of the 25W wireless charging module features the D9512C wireless charging controller IC, D9022 full-bridge power IC, authentication IC, resonant capacitors, and other components. The front side of the 15W wireless charging module features the D9516 wireless charging controller IC, D9015A full-bridge power IC, 3.3µH inductor, crystal oscillator, and other components.

Comparing the two, the 25W module achieves a higher-power design layout with very few components.

Wireless Charging Controller IC

The core difference between the two modules lies in the controller IC.

The 25W wireless charging module is equipped with the D9512C, a new-generation fully synchronous digital demodulation wireless charging transmitter controller IC designed for MPP Qi2.2. It supports MPP/EPP protocols and delivers up to 25W output. The 15W wireless charging module is equipped with the D9516, also a fully synchronous digital demodulation TX IC, compatible with the MPP Qi2.0 standard and supporting up to 15W.

Although the D9512C’s core frequency drops from 128MHz on the D9516 to 72MHz, its PWM frequency remains at 144MHz—control precision is not compromised. Both chips use a QFN32 4×4mm package and support the PD protocol and USB in-system firmware upgrades.

The real difference is integration level.

The D9512C integrates more functions into the chip: some external peripheral circuits required in the D9516 solution are eliminated in the D9512C solution. EMC optimization also relies more on chip-level design rather than external filter networks. In addition, the D9512C has built-in cycle-by-cycle hardware-level OCP protection, supports finer adjustable drive speed, is backward compatible with Qi2.1 EPP 15W, and integrates authentication-related circuits to support Qi2.2 MPP certification.

From an external component perspective: the D9516 solution requires an external 3.3µH inductor and multiple resistors and capacitors; the D9512C solution needs only a few core ICs and minimal external components to achieve 25W power output.

This is why power is 10W higher, yet component count is lower—the D9512C uses a more streamlined external circuit to achieve higher power density and better system integration.

Summary

Through teardown comparison, we can see that as power increases from 15W to 25W, component count actually decreases—this is not magic, but the inevitable result of an upgraded chip architecture.

Both chips integrate the PD protocol and support USB in-system upgrades. The difference is that the D9512C, through architectural optimization, achieves higher power density, finer control precision, and more optimized EMC design within the same package, thereby reducing dependence on surrounding compensation components and filter networks.

For product developers, this means:

→ Lower BOM cost—fewer components, lower procurement and SMT costs
→ Simpler PCB layout—shorter traces, easier EMC compliance
→ Higher reliability—fewer components, fewer potential failure points
→ Shorter development cycle—simpler peripheral circuits, less debugging workload

For detailed datasheets and samples of both modules, please contact Bieland. Technical parameters are subject to the official datasheets. For specific applications, please contact a sales engineer.